The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2021
Filed:
Jan. 16, 2020
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Rabiul Islam, Hsinchu, TW;
Chuei-Tang Wang, Taichung, TW;
Stefan Rusu, Sunnyvale, CA (US);
Weiwei Song, San Jose, CA (US);
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A package structure includes a package component, a stacked die package, a plurality of optical fibers and a heat spreading structure. The stacked die package is disposed on and electrically connected to the package component. The stacked die package includes a first semiconductor die and a plurality of second semiconductor dies. The first semiconductor die has a plurality of first bonding elements. The second semiconductor dies are disposed on the first semiconductor die and have a plurality of second bonding elements, wherein the plurality of first bonding elements and the plurality of second bonding elements are facing one another and bonded together through hybrid bonding. The plurality of optical fibers is attached to the plurality of second semiconductor dies of the stacked die package. The heat spreading structure is disposed on the package component and surrounding the stacked die package.