The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Oct. 03, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Raman K. Nurani, Chennai, IN;

Anantha R. Sethuraman, Palo Alto, CA (US);

Koushik Ragavan, Chennai, IN;

Karanpreet Aujla, Greenbrae, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 13/04 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); G05B 19/418 (2006.01);
U.S. Cl.
CPC ...
H01L 22/34 (2013.01); G05B 13/048 (2013.01); G05B 19/4184 (2013.01); H01L 21/67253 (2013.01); H01L 22/20 (2013.01); G05B 2219/32075 (2013.01); G05B 2219/32224 (2013.01); G05B 2219/37224 (2013.01); H01L 21/67288 (2013.01);
Abstract

Implementations described herein generally relate to improving silicon wafer manufacturing. In one implementation, a method includes receiving information describing a defect. The method further includes identifying a critical area of a silicon wafer and determining the probability of the defect occurring in the critical area. The method further includes determining, based on the probability, the likelihood of an open or a short occurring as a result of the defect occurring in the critical area. The method further includes providing, based on the likelihood, predictive information to a manufacturing system. In some embodiments, corrective action may be taken based on the predictive information in order to improve silicon wafer manufacturing.


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