The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2021

Filed:

Mar. 17, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Fee Li Lie, Albany, NY (US);

Effendi Leobandung, Stormville, NY (US);

Richard C. Johnson, Selkirk, NY (US);

Scott Halle, Slingerlands, NY (US);

Robin Hsin Kuo Chao, Portland, OR (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); G01N 21/95 (2006.01); H01L 21/66 (2006.01); G01R 31/3185 (2006.01); G01N 21/956 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01N 21/956 (2013.01); G01R 31/318511 (2013.01); H01L 22/24 (2013.01);
Abstract

Techniques for secure and tamper-resistant wafer identification using a unique wafer fingerprint are provided. In one aspect, a method for wafer authentication includes: placing, at each level of fabrication of chips on the wafer, reference structures across the chips; inspecting the wafer at each level of the fabrication; and performing at least one of overlay and scatterometry measurements of the reference structures to use as a unique fingerprint for authenticating the wafer that has been inspected. A method for authentication throughout a process flow for fabrication of chips on a wafer is also provided, as is a wafer having chips and reference structures placed across the chips at each level of the chips to provide a unique fingerprint for authenticating the wafer.


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