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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11069512 B1

PDFFull Text
Date of Patent:
Jul. 20, 2021

Filed:

Aug. 08, 2017

Film forming apparatus and gas injection member used therefor

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Shinya Okabe, Yamanashi, JP;

Takashi Mochizuki, Yamanashi, JP;

Hideaki Yamasaki, Yamanashi, JP;

Nagayasu Hiramatsu, Yamanashi, JP;

Kazuki Dempoh, Yamanashi, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorney:

Fenwick & West LLP

Primary Examiner:

Rudy Zervigon

Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/455 (2006.01); C23C 16/04 (2006.01); C23C 16/34 (2006.01); C23C 16/509 (2006.01); C23C 16/14 (2006.01); C23C 16/56 (2006.01); H01L 21/768 (2006.01); C23C 16/06 (2006.01); C23C 16/458 (2006.01); C23C 16/46 (2006.01); C23C 16/50 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3244 (2013.01); C23C 16/045 (2013.01); C23C 16/06 (2013.01); C23C 16/14 (2013.01); C23C 16/34 (2013.01); C23C 16/458 (2013.01); C23C 16/45565 (2013.01); C23C 16/46 (2013.01); C23C 16/50 (2013.01); C23C 16/5096 (2013.01); C23C 16/56 (2013.01); H01J 37/32724 (2013.01); H01L 21/28556 (2013.01); H01L 21/28568 (2013.01); H01L 21/76843 (2013.01); H01J 2237/327 (2013.01); H01J 2237/3321 (2013.01); H01J 2237/3323 (2013.01); H01L 21/28518 (2013.01); H01L 21/76856 (2013.01);
Abstract

A film forming apparatus, for forming a film on a target substrate using a processing gas excited by plasma, includes: a processing chamber for accommodating the substrate; a mounting table for mounting thereon the substrate in the processing chamber; a gas injection member provided to face the substrate mounted on the mounting table and configured to inject the processing gas toward the target substrate on the mounting table; and a plasma generation unit for exciting the processing gas by generating plasma between the gas injection member and the mounting table. The gas injection member has a gas injection surface facing the mounting table. Gas injection holes are formed in the gas injection surface. A gas injection hole forming region, on the gas injection surface, where the gas injection holes are formed is smaller than a region on the gas injection surface which corresponds to the target substrate.

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