The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Jan. 20, 2017
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Nobuyuki Terasaki, Saitama, JP;
Yoshiyuki Nagatomo, Saitama, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/373 (2006.01); C04B 35/645 (2006.01); C04B 37/02 (2006.01); H01L 21/48 (2006.01); F28F 3/12 (2006.01); F28F 21/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); C04B 35/645 (2013.01); C04B 37/026 (2013.01); H01L 21/4882 (2013.01); C04B 2235/6562 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/6581 (2013.01); C04B 2235/661 (2013.01); C04B 2237/122 (2013.01); C04B 2237/124 (2013.01); C04B 2237/126 (2013.01); C04B 2237/343 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/407 (2013.01); C04B 2237/704 (2013.01); C04B 2237/706 (2013.01); C04B 2237/708 (2013.01); C04B 2237/72 (2013.01); F28F 3/12 (2013.01); F28F 21/085 (2013.01); H01L 2224/32225 (2013.01);
Abstract
A bonded body of the present invention includes a ceramic member formed of ceramics and a Cu member formed of Cu or a Cu alloy. In a bonded interface between the ceramic member and the Cu member, a Cu—Sn layer which is positioned on the ceramic member side and in which Sn forms a solid solution in Cu, a first intermetallic compound layer which is positioned on the Cu member side and contains Cu and Ti, and a second intermetallic compound layer which is positioned between the first intermetallic compound layer and the Cu—Sn layer and contains P and Ti are formed.