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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11062940 B1

PDFFull Text
Date of Patent:
Jul. 13, 2021

Filed:

Jun. 17, 2019

Organometallic precursors, methods of forming a layer using the same and methods of manufacturing semiconductor devices using the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Chang-Woo Sun, Hwaseong-si, KR;

Ji-Eun Yun, Hwaseong-si, KR;

Jae-Soon Lim, Seoul, KR;

Youn-Joung Cho, Hwaseong-si, KR;

Myong-Woon Kim, Daejeon, KR;

Kang-yong Lee, Daejeon, KR;

Sang-Ick Lee, Daejeon, KR;

Sung-Woo Cho, Daegu, KR;

Assignees:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

DNF Co., Ltd., Daejeon, KR;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Joseph A Miller, Jr

Int. Cl.
CPC ...
C23C 16/455 (2006.01); H01L 21/768 (2006.01); C07F 17/00 (2006.01); C23C 16/18 (2006.01); C23C 16/34 (2006.01); C07F 11/00 (2006.01); H01L 21/285 (2006.01); H01L 27/108 (2006.01); H01L 27/11582 (2017.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76841 (2013.01); C07F 11/00 (2013.01); C07F 17/00 (2013.01); C23C 16/18 (2013.01); C23C 16/34 (2013.01); C23C 16/45553 (2013.01); H01L 21/28562 (2013.01); H01L 21/76843 (2013.01); H01L 27/1085 (2013.01); H01L 27/11582 (2013.01); H01L 28/60 (2013.01);
Abstract

An organometallic precursor includes tungsten as a central metal and a cyclopentadienyl ligand bonded to the central metal. A first structure including an alkylsilyl group or a second structure including an allyl ligand is bonded to the cyclopentadienyl ligand or bonded to the central metal.

Find Patent Forward Citations

Quick Actions:

Sun, Chang-Woo. (2021). Organometallic precursors, methods of forming a layer using the same and methods of manufacturing semiconductor devices using the same (U.S. Patent No. 11062940). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11062940

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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