The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2021
Filed:
Dec. 07, 2018
Applicant:
Asm International N.v., Almere, NL;
Inventors:
Assignee:
ASM INTERNATIONAL N.V., Almere, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/285 (2006.01); C23C 16/04 (2006.01); C23C 16/14 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01); C23C 16/455 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7685 (2013.01); C23C 16/04 (2013.01); C23C 16/14 (2013.01); C23C 16/45536 (2013.01); C23C 16/45553 (2013.01); H01L 21/02068 (2013.01); H01L 21/28518 (2013.01); H01L 21/28562 (2013.01); H01L 21/28568 (2013.01); H01L 21/3105 (2013.01); H01L 21/76826 (2013.01); H01L 21/76849 (2013.01); H01L 21/76864 (2013.01); H01L 21/76867 (2013.01); H01L 21/76883 (2013.01); H01L 21/76886 (2013.01); H01L 21/76889 (2013.01); H01L 23/53238 (2013.01);
Abstract
Metallic layers can be selectively deposited on one surface of a substrate relative to a second surface of the substrate. In some embodiments, the metallic layers are selectively deposited on copper instead of insulating or dielectric materials. In some embodiments, a first precursor forms a layer on the first surface and is subsequently reacted or converted to form a metallic layer. The deposition temperature may be selected such that a selectivity of above about 50% or even about 90% is achieved.