The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2021
Filed:
Jan. 17, 2020
Tokyo Electron Limited, Tokyo, JP;
Koichi Yatsuda, Tokyo, JP;
Takashi Hayakawa, Tokyo, JP;
Hiroshi Okuno, Tokyo, JP;
Reiji Niino, Nirasaki, JP;
Hiroyuki Hashimoto, Nirasaki, JP;
Tatsuya Yamaguchi, Nirasaki, JP;
TOKYO ELECTRON LIMITED, Tokyo, JP;
Abstract
There is provided a method of fabricating a semiconductor device by performing a process on a substrate, which includes: forming a masking film made of a polymer having a urea bond by supplying polymerizing raw materials to a surface of the substrate on which an etching target film formed; forming an etching pattern on the masking film; subsequently, etching the etching target film with a processing gas using the etching pattern; and subsequently, removing the masking film by heating the substrate to depolymerize the polymer.