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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11049738 B1

PDFFull Text
Date of Patent:
Jun. 29, 2021

Filed:

Apr. 17, 2018

Substrate heating device

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Hibiki Otani, Koshi, JP;

Yukinobu Otsuka, Koshi, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorneys:

Nath, Goldberg & Meyer

Jerald L. Meyer

Tanya E. Harkins

Primary Examiner:

Sylvia MacArthur

Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67103 (2013.01); H01L 21/6719 (2013.01); H01L 21/67109 (2013.01); H01L 21/67748 (2013.01); H01L 21/68742 (2013.01); H01L 21/68764 (2013.01); H01L 21/68785 (2013.01);
Abstract

A substrate heating device includes: a heating plate for heating a first substrate mounted thereon; a cooling plate installed adjacent to the heating plate and for mounting a second substrate, before being heated, introduced to the cooling plate, and cool the first substrate; a substrate transfer mechanism for transferring the first or second substrate between the cooling plate and the heating plate; a heat shielding plate installed across a region below the heating plate and the cooling plate; a cooling mechanism for cooling the heat shielding plate; and a low oxygen atmosphere forming part for setting an atmosphere in which the first substrate is heated to a low oxygen atmosphere, wherein the substrate transfer mechanism includes a substrate holding part for holding the first or second substrate and a moving mechanism installed below the heat shielding plate to move the substrate holding part in the front-back direction.

Find Patent Forward Citations

Otani, Hibiki. (2021). Substrate heating device (U.S. Patent No. 11049738). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11049738

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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