The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 2021

Filed:

Jan. 27, 2017
Applicant:

Acorn Technologies, Inc., La Jolla, CA (US);

Inventors:

Daniel E. Grupp, San Francisco, CA (US);

Daniel J. Connelly, San Francisco, CA (US);

Assignee:

ACORN SEMI, LLC, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/47 (2006.01); H01L 21/285 (2006.01); H01L 29/08 (2006.01); H01L 29/45 (2006.01); H01L 29/49 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/812 (2006.01); H01L 23/535 (2006.01); H01L 29/06 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/47 (2013.01); H01L 21/28537 (2013.01); H01L 23/535 (2013.01); H01L 29/0649 (2013.01); H01L 29/0895 (2013.01); H01L 29/456 (2013.01); H01L 29/4908 (2013.01); H01L 29/66143 (2013.01); H01L 29/66636 (2013.01); H01L 29/66643 (2013.01); H01L 29/66666 (2013.01); H01L 29/66772 (2013.01); H01L 29/66795 (2013.01); H01L 29/66848 (2013.01); H01L 29/785 (2013.01); H01L 29/7827 (2013.01); H01L 29/7839 (2013.01); H01L 29/812 (2013.01); H01L 29/8126 (2013.01); H01L 29/78 (2013.01); H01L 29/78696 (2013.01); Y10S 438/958 (2013.01);
Abstract

A transistor having at least one passivated Schottky barrier to a channel includes an insulated gate structure on a p-type substrate in which the channel is located beneath the insulated gate structure. The channel and the insulated gate structure define a first and second undercut void regions that extend underneath the insulated gate structure toward the channel from a first and a second side of the insulated gate structure, respectively. A passivation layer is included on at least one exposed sidewall surface of the channel and metal source and drain terminals are located on respective first and second sides of the channel, including on the passivation layer and within the undercut void regions beneath the insulated gate structure. At least one of the metal source and drain terminals comprises a metal that has a work function near a valence band of the p-type substrate.


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