The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 2021

Filed:

Nov. 12, 2019
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Corey Lemley, Troy, NY (US);

Richard Farrell, Seattle, WA (US);

Hoyoung Kang, Guilderland, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/455 (2006.01); C23C 16/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02348 (2013.01); C23C 16/04 (2013.01); C23C 16/45525 (2013.01); H01L 21/0212 (2013.01); H01L 21/0228 (2013.01); H01L 21/02334 (2013.01);
Abstract

Methods for processing a substrate are provided. The method includes receiving a substrate. The substrate has a front side surface, a backside surface, and a side edge surface. The method also includes coating the front side surface, the backside surface and the side edge surface with a self-assembled monolayer and exposing an area of interest with actinic radiation. The actinic radiation causes a de-protection reaction within the self-assembled monolayer within the central region. The method also includes removing the self-assembled monolayer from the area of interest while the self-assembled monolayer remains on remaining surfaces of the substrate.


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