The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 2021

Filed:

Aug. 23, 2019
Applicant:

Versum Materials Us, Llc, Tempe, AZ (US);

Inventors:

Manchao Xiao, San Diego, CA (US);

Robert Gordon Ridgeway, Chandler, AZ (US);

Daniel P. Spence, Carlsbad, CA (US);

Xinjian Lei, Vista, CA (US);

Raymond Nicholas Vrtis, Carefree, AZ (US);

Assignee:

Versum Materials US, LLC, Tempe, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C07F 7/18 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02216 (2013.01); C07F 7/18 (2013.01); H01L 21/02126 (2013.01); H01L 21/02203 (2013.01); H01L 21/02274 (2013.01); H01L 21/02348 (2013.01);
Abstract

A method and composition for producing a low k dielectric film via plasma enhanced chemical vapor deposition comprise the steps of: providing a substrate within a reaction chamber; introducing into the reaction chamber gaseous reagents including at least one structure-forming precursors comprising a silacycloalkane compound, an oxygen source, and optionally a porogen; applying energy to the gaseous reagents in the reaction chamber to induce reaction of the gaseous reagents to deposit a low k dielectric film having dielectric constant of 3.2 or less. In certain embodiments, the structure-forming precursor further comprises a hardening additive.


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