The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2021
Filed:
May. 13, 2019
Applicant:
Taiwan Semiconductor Manufacturing Company Limited, Hsin-Chu, TW;
Inventors:
Jean-Pierre Colinge, Hsinchu, TW;
Kuo-Cheng Ching, Zhubei, TW;
Ta-Pen Guo, Taipei, TW;
Carlos H. Diaz, Mountain View, CA (US);
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/308 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); H01L 29/775 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7827 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); H01L 21/3086 (2013.01); H01L 29/0657 (2013.01); H01L 29/0676 (2013.01); H01L 29/42392 (2013.01); H01L 29/66439 (2013.01); H01L 29/66666 (2013.01); H01L 29/775 (2013.01); H01L 21/32139 (2013.01);
Abstract
A semiconductor arrangement comprises a substrate region and a first semiconductor column projecting from the substrate region. The semiconductor arrangement comprises a second semiconductor column projecting from the substrate region. The second semiconductor column is separated a first distance from the first semiconductor column. The first distance is between about 10 nm to about 30 nm.