The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2021
Filed:
Feb. 25, 2018
Applicant:
Kla-tencor Corporation, Milpitas, CA (US);
Inventors:
Assignee:
KLA-Tencor Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 21/02 (2006.01); G06N 3/04 (2006.01); G01B 21/20 (2006.01); H01L 21/66 (2006.01); G01R 31/28 (2006.01); G06N 3/08 (2006.01);
U.S. Cl.
CPC ...
G01B 21/02 (2013.01); G01B 21/20 (2013.01); G01R 31/2846 (2013.01); G06N 3/04 (2013.01); G06N 3/08 (2013.01); H01L 22/20 (2013.01); G01B 2210/56 (2013.01); H01L 22/12 (2013.01);
Abstract
Systems and methods for determining location of critical dimension (CD) measurement or inspection are disclosed. Real-time selection of locations to take critical dimension measurements based on potential impact of critical dimension variations at the locations can be performed. The design of a semiconductor device also can be used to predict locations that may be impacted by critical dimension variations. Based on an ordered location list, which can include ranking or criticality, critical dimension can be measured at selected locations. Results can be used to refine a critical dimension location prediction model.