The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2021
Filed:
Feb. 09, 2018
Applicant:
Intel Ip Corporation, Santa Clara, CA (US);
Inventors:
Saravana Maruthamuthu, Munich, DE;
Bernd Waidhas, Pettendorf, DE;
Andreas Augustin, Munich, DE;
Georg Seidemann, Landshut, DE;
Assignee:
Intel IP Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 19/06 (2006.01); H01Q 15/08 (2006.01); H01L 23/66 (2006.01); H01L 23/528 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/3205 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 23/13 (2006.01); H01Q 1/48 (2006.01);
U.S. Cl.
CPC ...
H01Q 19/06 (2013.01); H01L 21/32051 (2013.01); H01L 21/4846 (2013.01); H01L 21/56 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/13 (2013.01); H01L 23/49838 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/66 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01Q 1/48 (2013.01); H01Q 15/08 (2013.01); H01L 24/05 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/142 (2013.01);
Abstract
Some embodiments include packages and methods of making the packages. One of the packages includes a ground layer (e.g., a ground plane) of metal formed over a chip of die, an antenna element of metal formed over the ground layer, and a dielectric lens formed over the antenna element. The dielectric lens includes a plurality of dielectric layers that have graded dielectric constants in a decreasing order along a direction from the antenna element toward a top surface of the package.