The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2021
Filed:
Aug. 23, 2019
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Christopher Glancey, Boise, ID (US);
Shams U. Arifeen, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/3121 (2013.01); H01L 23/49861 (2013.01);
Abstract
A microelectronic device and/or microelectronic device package having a warpage control structure. The warpage control structure may be positioned over an encapsulating material, wherein the encapsulating material is positioned between the warpage control structure and a die positioned over a substrate. The warpage control structure may have a first thickness over a first portion of the encapsulating material and a second thickness over a second portion of the encapsulating material. Methods of forming the microelectronic device are also disclosed herein.