The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Jul. 05, 2017
Applicant:

Inevit Llc, Redwood City, CA (US);

Inventors:

Heiner Fees, Bietigheim-Bissingen, DE;

Andreas Track, Sachsenheim, DE;

Alexander Eichhorn, Eppingen, DE;

Ralf Maisch, Abstatt, DE;

Jörg Damaske, Freiberg, DE;

Martin Eberhard, Woodside, CA (US);

Assignee:

TIVENI MERGECO, INC., Redwood City, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01M 50/502 (2021.01); B23K 26/21 (2014.01); B60L 50/64 (2019.01); B60L 58/21 (2019.01); B60K 1/00 (2006.01); B60K 1/04 (2019.01); B62D 21/15 (2006.01); H01M 50/10 (2021.01); H01M 50/20 (2021.01); H01M 50/56 (2021.01); H01M 50/107 (2021.01); H01M 50/116 (2021.01); H01M 50/147 (2021.01); H01M 50/152 (2021.01); H01M 50/166 (2021.01); H01M 50/171 (2021.01); H01M 50/528 (2021.01); H01M 50/529 (2021.01); H01M 50/543 (2021.01); H01M 50/545 (2021.01); H01M 10/613 (2014.01); H01M 10/625 (2014.01); B23K 26/26 (2014.01); B23K 101/36 (2006.01); H01M 10/643 (2014.01); H01M 10/6552 (2014.01); B23K 101/38 (2006.01); B62D 21/18 (2006.01); F16M 1/00 (2006.01); H01M 50/572 (2021.01);
U.S. Cl.
CPC ...
H01M 50/502 (2021.01); B23K 26/21 (2015.10); B23K 26/26 (2013.01); B60K 1/00 (2013.01); B60K 1/04 (2013.01); B60L 50/64 (2019.02); B60L 58/21 (2019.02); B62D 21/152 (2013.01); B62D 21/155 (2013.01); H01M 10/613 (2015.04); H01M 10/625 (2015.04); H01M 50/10 (2021.01); H01M 50/107 (2021.01); H01M 50/116 (2021.01); H01M 50/147 (2021.01); H01M 50/152 (2021.01); H01M 50/166 (2021.01); H01M 50/171 (2021.01); H01M 50/20 (2021.01); H01M 50/528 (2021.01); H01M 50/529 (2021.01); H01M 50/543 (2021.01); H01M 50/545 (2021.01); H01M 50/56 (2021.01); B23K 2101/36 (2018.08); B23K 2101/38 (2018.08); B60K 2001/001 (2013.01); B60K 2001/005 (2013.01); B60K 2001/0438 (2013.01); B60K 2001/0461 (2013.01); B60Y 2306/01 (2013.01); B62D 21/18 (2013.01); F16M 1/00 (2013.01); H01M 10/643 (2015.04); H01M 10/6552 (2015.04); H01M 50/572 (2021.01); H01M 2200/103 (2013.01); H01M 2220/20 (2013.01);
Abstract

Embodiments are directed to establishing a direct electrical bond between a bonding connector of a contact plate and a battery cell in a battery module. In a first embodiment, an oscillating laser is used to weld the bonding connector to a battery cell terminal over a target area over which the bonding connector makes non-flush contact. In a second embodiment, the bonding connector is flattened to reduce a gap between the bonding connector and the target area on the battery cell terminal, and then laser-welded (e.g., using an oscillating or non-oscillating laser). In a third embodiment, at least one hold-down mechanism is applied over the bonding connector to secure the bonding connector to the battery cell terminal, after which the bonding connector is laser-welded to the battery cell terminal.


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