The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Nov. 19, 2019
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Jacklyn Chang, San Ramon, CA (US);

Kuoyuan (Peter) Hsu, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 27/112 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); G06F 30/392 (2020.01);
U.S. Cl.
CPC ...
H01L 27/0207 (2013.01); G06F 30/392 (2020.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 27/11226 (2013.01);
Abstract

A method includes placing first and second oxide diffusion (OD) layout patterns in a layout design corresponding to first, second, third, and fourth memory cells of a memory circuit. The first OD layout pattern extends along a first direction and has a first source portion shared between the first and second memory cells, and the second OD layout pattern extends along the first direction and has a second source portion shared between the third and fourth memory cells. The method includes placing a first conductive layout pattern in the layout diagram, the first conductive layout pattern corresponding to a first conductive structure under a lowest via plug layer of the memory circuit, extending along a second direction, and overlapping the first source portion and the second source portion. The method is wholly or partially performed by using a hardware processor.


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