The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 2021

Filed:

Nov. 19, 2018
Applicant:

Asml Netherlands B.v., Veldhoven, NL;

Inventors:

Joannes Jitse Venselaar, 's-Hertogenbosch, NL;

Anagnostis Tsiatmas, Eindhoven, NL;

Samee Ur Rehman, Eindhoven, NL;

Paul Christiaan Hinnen, Veldhoven, NL;

Jean-Pierre Agnes Henricus Marie Vaessen, Echt, NL;

Nicolas Mauricio Weiss, Hilversum, NL;

Gonzalo Roberto Sanguinetti, Eindhoven, NL;

Thomai Zacharopoulou, Eindhoven, NL;

Martijn Maria Zaal, Veldhoven, NL;

Assignee:

ASML Netherlands B.V., Veldhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 1/00 (2006.01); G03F 7/20 (2006.01); G06F 17/12 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70633 (2013.01); G03F 7/705 (2013.01); G03F 7/70508 (2013.01); G03F 7/70516 (2013.01); G06F 17/12 (2013.01);
Abstract

Methods of determining information about a patterning process. In a method, measurement data from a metrology process applied to each of a plurality of metrology targets on a substrate is obtained. The measurement data for each metrology target includes at least a first contribution and a second contribution. The first contribution is from a parameter of interest of a patterning process used to form the metrology target. The second contribution is from an error in the metrology process. The method further includes using the obtained measurement data from all of the plurality of metrology targets to obtain information about an error in the metrology process, and using the obtained information about the error in the metrology process to extract a value of the parameter of interest for each metrology target.


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