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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11022880 B1

PDFFull Text
Date of Patent:
Jun. 01, 2021

Filed:

Oct. 15, 2018

Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template, method of manufacturing plated article, and mercapto compound

Applicant:

Tokyo Ohka Kogyo Co., Ltd., Kawasaki, JP;

Inventors:

Akiya Kawaue, Kawasaki, JP;

Yuta Yamamoto, Kawasaki, JP;

Kazuaki Ebisawa, Kawasaki, JP;

Yasushi Kuroiwa, Kawasaki, JP;

Assignee:

Tokyo Ohka Kogyo Co., Ltd., Kawasaki, JP;

Attorney:

Knobbe Martens Olson & Bear LLP

Primary Examiner:

John S Chu

Int. Cl.
CPC ...
G03F 7/004 (2006.01); G03F 7/039 (2006.01); G03F 7/38 (2006.01); G03F 7/16 (2006.01); G03F 7/32 (2006.01); C07D 493/08 (2006.01); C07C 323/61 (2006.01); G03F 7/20 (2006.01); G03F 7/40 (2006.01); C07D 307/93 (2006.01); C07D 249/12 (2006.01); C07C 323/62 (2006.01); C07D 249/10 (2006.01); C07D 249/06 (2006.01); C07C 321/22 (2006.01); C07D 495/08 (2006.01); C07C 321/24 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0045 (2013.01); C07C 323/61 (2013.01); C07C 323/62 (2013.01); C07D 249/06 (2013.01); C07D 249/10 (2013.01); C07D 249/12 (2013.01); C07D 307/93 (2013.01); C07D 493/08 (2013.01); G03F 7/0392 (2013.01); G03F 7/0397 (2013.01); G03F 7/16 (2013.01); G03F 7/168 (2013.01); G03F 7/2008 (2013.01); G03F 7/322 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01); C07C 321/22 (2013.01); C07C 321/24 (2013.01); C07C 2601/14 (2017.05); C07C 2602/42 (2017.05); C07D 495/08 (2013.01);
Abstract

A chemically amplified positive-type photosensitive resin composition capable of suppressing the occurrence of 'footing' in which the width of the bottom (the side proximal to the surface of a support) becomes narrower than that of the top (the side proximal to the surface of a resist layer) in the nonresist portion; and the generation of development residue when a resist pattern serving as a template for a plated article is formed on a metal surface of a substrate using the photosensitive resin composition. A mercapto compound having a specific structure is included in the photosensitive resin composition, and includes an acid generator which generates acid upon exposure to an irradiated active ray or radiation, and a resin whose solubility in alkali increases under the action of acid.

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