The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2021
Filed:
Oct. 25, 2018
Applied Materials, Inc., Santa Clara, CA (US);
Shu-Kwan Lau, Sunnyvale, CA (US);
Koji Nakanishi, Taito-Ku, JP;
Toshiyuki Nakagawa, Narita, JP;
Zuoming Zhu, Sunnyvale, CA (US);
Zhiyuan Ye, San Jose, CA (US);
Joseph M. Ranish, San Jose, CA (US);
Nyi O. Myo, San Jose, CA (US);
Errol Antonio C. Sanchez, Tracy, CA (US);
Schubert S. Chu, San Francisco, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.