The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2021

Filed:

Sep. 05, 2018
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Michael Mutch, Meridian, ID (US);

Manuj Nahar, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/161 (2006.01); H01L 29/04 (2006.01); H01L 29/786 (2006.01); H01L 21/02 (2006.01); C30B 25/18 (2006.01); H01L 27/105 (2006.01);
U.S. Cl.
CPC ...
H01L 29/161 (2013.01); C30B 25/18 (2013.01); H01L 21/0262 (2013.01); H01L 21/02532 (2013.01); H01L 29/04 (2013.01); H01L 29/78642 (2013.01); H01L 27/105 (2013.01);
Abstract

A method of forming a semiconductor structure includes forming a first material over a base material by vapor phase epitaxy. The first material has a crystalline portion and an amorphous portion. The amorphous portion of the first material is removed by abrasive planarization. At least a second material is formed by vapor phase epitaxy over the crystalline portion of first material. The second material has a crystalline portion and an amorphous portion. The amorphous portion of the second material is removed by abrasive planarization. A semiconductor structure formed by such a method includes the substrate, the first material, the second material, and optionally, an oxide material between the first material and the second material. The substrate, the first material, and the second material define a continuous crystalline structure. Semiconductor structures, memory devices, and systems are also disclosed.


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