The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2021

Filed:

May. 11, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Yi-Lin Chuang, Taipei, TW;

Ching-Fang Chen, Taichung, TW;

Wei-Li Chen, Zhubei, TW;

Wei-Pin Changchien, Taichung, TW;

Yung-Chin Hou, Taipei, TW;

Yun-Han Lee, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/398 (2020.01); G06N 20/00 (2019.01); G06F 30/30 (2020.01); G06F 30/27 (2020.01); G06F 30/3308 (2020.01); G06F 30/337 (2020.01); G06F 30/373 (2020.01); H01L 27/02 (2006.01); H05K 3/00 (2006.01); G06F 30/392 (2020.01); G06F 30/394 (2020.01); H01L 27/118 (2006.01); G06F 30/367 (2020.01); G06F 111/06 (2020.01); G06F 111/02 (2020.01); G06F 119/22 (2020.01);
U.S. Cl.
CPC ...
G06F 30/398 (2020.01); G06F 30/27 (2020.01); G06F 30/30 (2020.01); G06F 30/337 (2020.01); G06F 30/3308 (2020.01); G06F 30/373 (2020.01); G06N 20/00 (2019.01); G06F 30/367 (2020.01); G06F 30/392 (2020.01); G06F 30/394 (2020.01); G06F 2111/02 (2020.01); G06F 2111/06 (2020.01); G06F 2119/22 (2020.01); H01L 27/0203 (2013.01); H01L 27/0207 (2013.01); H01L 2027/11859 (2013.01); H01L 2027/11864 (2013.01); H05K 3/00 (2013.01);
Abstract

Electronic design automation (EDA) of the present disclosure, in various embodiments, optimizes designing, simulating, analyzing, and verifying of one or more electronic architectural designs for an electronic device. The EDA of the present disclosure identifies one or more electronic architectural features from the one or more electronic architectural designs. In some situations, the EDA of the present disclosure can manipulate one or more electronic architectural models over multiple iterations using a machine learning process until one or more electronic architectural models from among the one or more electronic architectural models satisfy one or more electronic design targets. The EDA of the present disclosure substitutes the one or more electronic architectural models that satisfy the one or more electronic design targets for the one or more electronic architectural features in the one or more electronic architectural designs to optimize the one or more electronic architectural designs. The EDA of the present disclosure can substitute the one or more electronic architectural models before, during, and/or after designing, simulating, analyzing, and/or verifying of the one or more electronic architectural designs to effectively decrease the time to market (TTM) for the electronic device.


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