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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11013112 B1

PDFFull Text
Date of Patent:
May. 18, 2021

Filed:

Jun. 28, 2019

Ceramic copper circuit board and semiconductor device based on the same

Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Materials Co., Ltd., Yokohama, JP;

Inventors:

Hiromasa Kato, Nagareyama Chiba, JP;

Takashi Sano, Fujisawa Kanagawa, JP;

Assignees:

KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;

TOSHIBA MATERIALS CO., LTD., Yokohama, JP;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Yuriy Semenenko

Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/03 (2006.01); C22C 1/04 (2006.01); C22C 9/02 (2006.01); C22C 30/02 (2006.01); C22C 30/04 (2006.01); H01L 23/15 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); C22C 1/0425 (2013.01); C22C 9/02 (2013.01); C22C 30/02 (2013.01); C22C 30/04 (2013.01); H01L 23/15 (2013.01); H05K 1/092 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); C04B 2235/96 (2013.01); C04B 2237/407 (2013.01);
Abstract

According to one embodiment, a ceramic copper circuit board a ceramic substrate, a copper circuit board provided at one surface of the ceramic substrate. A ratio of a thickness of the copper circuit board to a thickness of the ceramic substrate is 1.25 or more. A number of grain boundaries is not less than 5 and not more than 250 along every 10-mm straight line drawn in a front surface of the copper circuit board.

Find Patent Forward Citations

Kato, Hiromasa. (2021). Ceramic copper circuit board and semiconductor device based on the same (U.S. Patent No. 11013112). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11013112

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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