The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2021
Filed:
Jun. 28, 2019
Applicants:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Materials Co., Ltd., Yokohama, JP;
Inventors:
Hiromasa Kato, Nagareyama Chiba, JP;
Takashi Sano, Fujisawa Kanagawa, JP;
Assignees:
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
TOSHIBA MATERIALS CO., LTD., Yokohama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/03 (2006.01); C22C 1/04 (2006.01); C22C 9/02 (2006.01); C22C 30/02 (2006.01); C22C 30/04 (2006.01); H01L 23/15 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); C22C 1/0425 (2013.01); C22C 9/02 (2013.01); C22C 30/02 (2013.01); C22C 30/04 (2013.01); H01L 23/15 (2013.01); H05K 1/092 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); C04B 2235/96 (2013.01); C04B 2237/407 (2013.01);
Abstract
According to one embodiment, a ceramic copper circuit board a ceramic substrate, a copper circuit board provided at one surface of the ceramic substrate. A ratio of a thickness of the copper circuit board to a thickness of the ceramic substrate is 1.25 or more. A number of grain boundaries is not less than 5 and not more than 250 along every 10-mm straight line drawn in a front surface of the copper circuit board.