The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2021

Filed:

Jul. 08, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Shogo Mochizuki, Clifton Park, NY (US);

Michael P. Belyansky, Halfmoon, NY (US);

Choonghyun Lee, Rensselaer, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/8238 (2006.01); H01L 21/8234 (2006.01); H01L 29/08 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66795 (2013.01); H01L 21/823418 (2013.01); H01L 21/823487 (2013.01); H01L 21/823814 (2013.01); H01L 21/823864 (2013.01); H01L 21/823885 (2013.01); H01L 29/66553 (2013.01); H01L 29/66666 (2013.01); H01L 29/7827 (2013.01); H01L 29/7831 (2013.01); H01L 29/0847 (2013.01); H01L 29/78642 (2013.01); H01L 2029/7858 (2013.01);
Abstract

A VFET device with a dual top spacer to prevent source/drain-to-gate short, and techniques for formation thereof are provided. In one aspect, a method of forming a VFET device includes: etching vertical fin channels in a substrate; forming a bottom source and drain in the substrate beneath the vertical fin channels; forming a bottom spacer on the bottom source and drain; depositing a gate dielectric and gate conductor onto the vertical fin channels; recessing the gate dielectric and gate conductor to expose tops of the vertical fin channels; selectively forming dielectric spacers on end portions of the gate dielectric and gate conductor adjacent to the tops of the vertical fin channels; depositing an encapsulation layer onto the vertical fin channels; recessing the encapsulation layer with the dielectric spacers serving as an etch stop; and forming top source and drains. A VFET device formed using the present techniques is also provided.


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