The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2021
Filed:
Feb. 01, 2016
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Volume Chien, Tainan, TW;
I-Chih Chen, Tainan, TW;
Hsin-Chi Chen, Tainan, TW;
Hung-Ta Huang, Tainan, TW;
Ying-Hao Chen, Tainan, TW;
Ying-Lang Wang, Tai-Chung County, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD, Hsin-Chu, TW;
Abstract
A bonding pad structure comprises an interconnect layer, an isolation layer over the interconnect layer, a conductive pad, and one or more non-conducting stress-releasing structures. The conductive pad comprises a planar portion over the isolation layer, and one or more bridging portions extending through at least the isolation layer and to the interconnect layer for establishing electric contact therewith, wherein there is a trench in the one or more bridging portions. The one or more non-conducting stress-releasing structures are disposed between the isolation layer and the conductive pad. The trench is surrounded by one of the one or more non-conducting stress-releasing structures from a top view.