The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2021
Filed:
Aug. 23, 2018
Applicant:
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Inventors:
Milind Bhagavat, Los Altos, CA (US);
David Hugh McIntyre, Sunnyvale, CA (US);
Rahul Agarwal, Livermore, CA (US);
Assignee:
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H02M 3/158 (2006.01); H02M 3/07 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 24/16 (2013.01); H01L 25/50 (2013.01); H01L 2224/16145 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06558 (2013.01); H01L 2225/06586 (2013.01); H01L 2924/1427 (2013.01); H01L 2924/1431 (2013.01); H02M 3/07 (2013.01); H02M 3/158 (2013.01);
Abstract
A data processor is implemented as an integrated circuit. The data processor includes a processor die. The processor die is connected to an integrated voltage regulator die using die-to-die bonding. The integrated voltage regulator die provides a regulated voltage to the processor die, and the processor die operates in response to the regulated voltage.