The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2021

Filed:

Apr. 24, 2018
Applicant:

Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);

Inventors:

Xisen Hou, Lebanon, NH (US);

Cong Liu, Shrewsbury, MA (US);

Irvinder Kaur, Northborough, MA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/11 (2006.01); G03F 7/40 (2006.01); G03F 7/16 (2006.01); G03F 7/00 (2006.01); C08F 220/68 (2006.01); H01L 21/027 (2006.01); C09D 133/16 (2006.01); C09D 133/02 (2006.01); G03F 7/039 (2006.01); G03F 7/004 (2006.01); C08F 212/14 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0035 (2013.01); C08F 212/14 (2013.01); C08F 220/68 (2013.01); C09D 133/02 (2013.01); C09D 133/16 (2013.01); G03F 7/0048 (2013.01); G03F 7/039 (2013.01); G03F 7/11 (2013.01); G03F 7/168 (2013.01); G03F 7/40 (2013.01); G03F 7/405 (2013.01); H01L 21/0274 (2013.01);
Abstract

A pattern formation method, comprising: (a) providing a semiconductor substrate; (b) forming a photoresist pattern over the semiconductor substrate, wherein the photoresist pattern is formed from a photoresist composition comprising: a first polymer comprising acid labile groups; and a photoacid generator; (c) coating a pattern overcoat composition over the photoresist pattern, wherein the pattern overcoat composition comprises a second polymer and an organic solvent, wherein the organic solvent comprises one or more ester solvents, wherein the ester solvent is of the formula R—C(O)O—R, wherein Ris a C3-C6 alkyl group and Ris a C5-C10 alkyl group; (d) baking the coated photoresist pattern; and (e) rinsing the coated photoresist pattern with a rinsing agent to remove the second polymer. The methods find particular applicability in the manufacture of semiconductor devices.


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