The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

May. 22, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Van H. Le, Portland, OR (US);

Scott B. Clendenning, Portland, OR (US);

Martin M. Mitan, Beaverton, OR (US);

Szuya S. Liao, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); B82Y 10/00 (2011.01); H01L 21/02 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 29/775 (2006.01); H01L 29/78 (2006.01); H01L 29/786 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66553 (2013.01); B82Y 10/00 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01); H01L 21/02238 (2013.01); H01L 21/02247 (2013.01); H01L 21/02252 (2013.01); H01L 29/0653 (2013.01); H01L 29/0673 (2013.01); H01L 29/42392 (2013.01); H01L 29/6681 (2013.01); H01L 29/66439 (2013.01); H01L 29/66545 (2013.01); H01L 29/66818 (2013.01); H01L 29/775 (2013.01); H01L 29/785 (2013.01); H01L 29/7853 (2013.01); H01L 29/78696 (2013.01); H01L 21/76224 (2013.01);
Abstract

Methods of selectively nitriding surfaces of semiconductor devices are disclosed. For example, a hardmask is formed on the top portion of the fins to create SOI structure. The hardmask may be formed by nitriding the top portion of the fin. In other embodiments, silicon nitride is grown on the top portion of the fin to form the hard masks. In another example, internal spacers are formed between adjacent nanowires in a gate-all-around structure. The internal spacers may be formed by nitriding the remaining interlayer material between the channel region and source and drain regions.


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