The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Apr. 22, 2019
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Ru-Gun Liu, Zhubei, TW;

Tung-Heng Hsieh, Zhudong Town, TW;

Tsung-Chieh Tsai, Chu-Bei, TW;

Juing-Yi Wu, Hsinchu, TW;

Liang-Yao Lee, Taoyuan, TW;

Jyh-Kang Ting, Baoshan Township, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); G06F 30/394 (2020.01); H01L 21/3213 (2006.01); H01L 27/118 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0207 (2013.01); G06F 30/394 (2020.01); H01L 21/76816 (2013.01); H01L 21/76877 (2013.01); H01L 21/76892 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/53209 (2013.01); H01L 23/53271 (2013.01); H01L 21/32139 (2013.01); H01L 23/522 (2013.01); H01L 2027/11875 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A conductive line structure includes two conductive lines in a layout. The two cut lines are over at least a part of the two conductive lines in the layout. The cut lines designate cut sections of the two conductive lines and the cut lines are spaced from each other within a fabrication process limit. The two cut lines are connected in the layout. The two conductive lines are patterned over a substrate in a physical integrated circuit using the two connected parallel cut lines. The two conductive lines are electrically conductive.


Find Patent Forward Citations

Loading…