The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Jul. 13, 2020
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Chu-An Lee, Hsinchu, TW;
Chen-Hao Wu, Hsinchu, TW;
Peng-Chung Jangjian, Hsinchu, TW;
Chun-Wen Hsiao, Hsinchu, TW;
Teng-Chun Tsai, Hsinchu, TW;
Huang-Lin Chao, Hillsboro, OR (US);
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A semiconductor device structure is provided. The semiconductor device structure includes a substrate having adjacent first and second fins protruding from the substrate. The semiconductor device structure also includes an insulating structure that includes a first insulating layer formed between and separating from the first fin and the second fin, a second insulating layer embedded in the first insulating layer, a first capping layer formed in the first insulating layer to cover a top surface of the second insulating layer, and a second capping layer in the first capping layer.