The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Sep. 20, 2019
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Wan-Yu Lo, Zhongli, TW;

Chung-Hsing Wang, Baoshan Township, TW;

Chin-Shen Lin, Taipei, TW;

Kuo-Nan Yang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/398 (2020.01); G06F 30/392 (2020.01); G06F 111/10 (2020.01); G06F 111/20 (2020.01); G06F 119/08 (2020.01);
U.S. Cl.
CPC ...
G06F 30/392 (2020.01); G06F 30/398 (2020.01); G06F 2111/10 (2020.01); G06F 2111/20 (2020.01); G06F 2119/08 (2020.01);
Abstract

In a method, based on an operating condition of a region of an integrated circuit (IC), a first relationship between a temperature and heating power of the region is determined. Based on a cooling capacity of the region, a second relationship between the temperature and cooling power of the region is determined. Based on the first relationship and the second relationship, it is determined whether the region is thermally stable. In response to a determination that the region is thermally unstable, at least one of a structure or the operating condition of the region is changed. At least one of the determination of the first relationship, the determination of the second relationship, the determination of thermally stability of the region, or the change of at least one of the structure or the operating condition of the region is executed by a processor.


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