The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2021

Filed:

Jan. 27, 2016
Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventors:

Yuji Takagi, Tokyo, JP;

Fumihiko Fukunaga, Tokyo, JP;

Yasunori Goto, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G03F 7/20 (2006.01); H01J 37/22 (2006.01); G06K 9/62 (2006.01); G06T 7/00 (2017.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70633 (2013.01); G06K 9/6255 (2013.01); G06T 7/001 (2013.01); H01J 37/22 (2013.01); H01L 23/544 (2013.01); G06T 2200/24 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/30148 (2013.01);
Abstract

An overlay measurement method using a reference image is an effective method for an overlay measurement in a product circuit. However, there is a problem that it is not possible to obtain an ideal reference image in a process of prototyping. A measurement device described in a specific embodiment of the present invention includes an imaging unit that captures an image of a circuit pattern of a semiconductor wafer surface by an optical microscope or an electronic microscope, a pattern recognition unit that extracts a first pattern and a second pattern from the image captured by the imaging unit, a reference image generation unit that synthesizes a first reference image using the first pattern extracted from a plurality of the images and synthesizes a second reference image using the second pattern extracted from the plurality of images, a quantification unit that quantifies a first difference that is a difference between the first reference image and the first pattern and a second difference that is a difference between the second reference image and the second pattern, and a calculation unit that calculates an overlay amount included in the circuit pattern using the first difference and the second difference.


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