The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Jun. 23, 2016
Siltectra Gmbh, Dresden, DE;
Marko Swoboda, Dresden, DE;
Christian Beyer, Dresden, DE;
Franz Schilling, Radeberg, DE;
Jan Richter, Dresden, DE;
Siltectra GmbH, Dresden, DE;
Abstract
The invention relates to a method for separating solid-body slices () from a donor substrate (). The method comprises the following steps: providing a donor substrate (), producing at least one modification () within the donor substrate () by means of at least one LASER beam (), wherein the LASER beam () penetrates the donor substrate () via a planar surface () of the donor substrate (), wherein the LASER beam () is inclined with respect to the planar surface () of the donor substrate () such that it penetrates the donor substrate at an angle of not equal to 0° or 180° relative to the longitudinal axis of the donor substrate, wherein the LASER beam () is focused in order to produce the modification () in the donor substrate () and the solid-body slice () detaches from the donor substrate () as a result of the modifications () produced or a stress-inducing layer () is produced or arranged on the planar surface () of the donor substrate () and mechanical stresses are produced in the donor substrate () by a thermal treatment of the stress-inducing layer (), wherein the mechanical stresses produce a crack () for separating a solid-body layer (), which crack propagates along the modifications ().