The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
Sep. 28, 2018
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Abstract
In a general aspect, a semiconductor device assembly can include a semiconductor die having a first surface including active circuitry, a second surface opposite the first surface, and a plurality of side surfaces. Each of the plurality of side surfaces can extend between the first surface of the semiconductor die and the second surface of the semiconductor die. The semiconductor device assembly can also include a conductive spacer having a cavity defined therein. The semiconductor die can be electrically and thermally coupled with the conductive spacer, the semiconductor die being at least partially embedded in the cavity.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile