The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2021
Filed:
Dec. 17, 2019
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Tsung-Yuan Yu, Taipei, TW;
Hao-Yi Tsai, Hsinchu, TW;
Chao-Wen Shih, Hsinchu County, TW;
Hung-Yi Kuo, Taipei, TW;
Pi-Lan Chang, Kaohsiung, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor device includes a first substrate, a pad array, a conductive bump, a first via and a dielectric. The pad array, formed on a surface of the first substrate, includes a first type pad and a second type pad at a same level. The conductive bump connects one of the first type pad of the second type pad to a second substrate. The first via, connected to a conductive feature at a different level to the first type pad, is located within a projection area of the first type pad and directly contacts the first type pad. The second type pad is laterally connected with a conductive trace on the same level. The conductive trace is connected to a second via at a same level with the first via. The dielectric in the first substrate contacts the second type pad. The second type pad is floated on the dielectric.