The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Mar. 01, 2016
Applicants:

Tdk Electroncis Ag, Munich, DE;

At&s Austria Technologie & Systemtechnik Ag, Leoben, AT;

Inventors:

Thomas Feichtinger, Graz, AT;

Oliver Dernovsek, Lieboch, AT;

Franz Rinner, Deutschlandsberg, AT;

Christian Vockenberger, Leoben, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 25/16 (2006.01); H01L 33/54 (2010.01); H01L 33/64 (2010.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0206 (2013.01); H01L 25/167 (2013.01); H01L 33/54 (2013.01); H01L 33/647 (2013.01); H05K 1/185 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10196 (2013.01); H05K 2201/10219 (2013.01);
Abstract

The present invention relates to a carrier () with a passive cooling function for a semiconductor component (), having a main body () with a top side () and a bottom side () and at least one electrical component () that is embedded in the main body (), wherein the carrier () has a first thermal via (), which extends from the top side () of the main body () to the at least one electrical component (), wherein the carrier () has a second thermal via (), which extends from the at least one electrical component () to the bottom side () of the main body (), and wherein the at least one embedded electrical component () is electrically contacted by the first and the second thermal via ().


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