The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

May. 28, 2015
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Atsushi Shiokawa, Tokyo, JP;

Tetsuro Sugiura, Tokyo, JP;

Shinichi Sekiguchi, Tokyo, JP;

Takashi Kyotani, Tokyo, JP;

Tetsuo Komai, Tokyo, JP;

Norio Kimura, Tokyo, JP;

Keiichi Ishikawa, Tokyo, JP;

Toru Osuga, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/44 (2006.01); H01L 21/67 (2006.01); F04B 37/16 (2006.01); H01L 21/205 (2006.01); H01L 21/3065 (2006.01); H01L 21/31 (2006.01); C23C 16/52 (2006.01); F04B 37/14 (2006.01); H01J 37/32 (2006.01); F04B 41/00 (2006.01); C23C 14/22 (2006.01); G05D 16/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67017 (2013.01); C23C 14/22 (2013.01); C23C 16/4412 (2013.01); C23C 16/52 (2013.01); F04B 37/14 (2013.01); F04B 37/16 (2013.01); F04B 41/00 (2013.01); G05D 16/2013 (2013.01); H01J 37/32834 (2013.01); H01J 37/32844 (2013.01); H01L 21/205 (2013.01); H01L 21/3065 (2013.01); H01L 21/31 (2013.01); H01L 21/67276 (2013.01); Y02C 20/30 (2013.01); Y02P 70/50 (2015.11);
Abstract

The present invention relates to a vacuum evacuation system used to evacuate a processing gas from one or more process chambers for use in, for example, a semiconductor-device manufacturing apparatus. The vacuum evacuation system is a vacuum apparatus for evacuating a gas from a plurality of process chambers (). The vacuum evacuation system includes a plurality of first vacuum pumps () coupled to the plurality of process chambers () respectively, a collecting pipe () coupled to the plurality of first vacuum pumps (), and a second vacuum pump () coupled to the collecting pipe ().


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