The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Jun. 20, 2017
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Masashi Imanaka, Yamanashi, JP;

Toshio Nakanishi, Yamanashi, JP;

Minoru Honda, Yamanashi, JP;

Koji Kotani, Yamanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/44 (2006.01); H01L 21/687 (2006.01); C23C 16/458 (2006.01); C23C 16/34 (2006.01); C23C 16/455 (2006.01); C23C 16/46 (2006.01); C23C 16/511 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4412 (2013.01); C23C 16/345 (2013.01); C23C 16/455 (2013.01); C23C 16/458 (2013.01); C23C 16/4585 (2013.01); C23C 16/46 (2013.01); C23C 16/511 (2013.01); H01J 37/3244 (2013.01); H01J 37/32192 (2013.01); H01J 37/32642 (2013.01); H01J 37/32724 (2013.01); H01L 21/0217 (2013.01); H01L 21/02274 (2013.01); H01L 21/68735 (2013.01);
Abstract

Provided is a plasma film-firming apparatus including: a chamber configured to accommodate a substrate therein; a substrate pedestal configured to disposed the substrate thereon within the chamber; a gas supply mechanism configured to supply a gas including a film-forming gas into the chamber; an exhaust mechanism configured to exhaust an inside of the chamber; and a plasma generating unit configured to generate plasma in the chamber. The substrate pedestal includes a pedestal body having a smaller diameter than that of the substrate and including a placement surface, and an annular adjustment member disposed outside the pedestal body. The adjustment member is replaceably installed. A plurality of adjustment members having various steps are provided at a position outside the substrate as the adjustment member, and among the plurality of adjustment members, an adjustment member is selected and used according to a processing condition of a plasma processing.


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