The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2021
Filed:
Dec. 24, 2015
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 39/24 (2006.01); H01B 12/04 (2006.01); B22D 11/00 (2006.01); C22C 9/00 (2006.01); H01F 6/06 (2006.01); H01B 12/02 (2006.01); B22D 11/12 (2006.01); H01B 12/00 (2006.01); B21B 1/46 (2006.01);
U.S. Cl.
CPC ...
H01B 12/04 (2013.01); B21B 1/463 (2013.01); B22D 11/00 (2013.01); B22D 11/12 (2013.01); C22C 9/00 (2013.01); H01B 12/00 (2013.01); H01B 12/02 (2013.01); H01F 6/06 (2013.01); Y02E 40/60 (2013.01); Y10T 29/49014 (2015.01);
Abstract
The present invention is a superconducting stabilization material used for a superconducting wire, which is formed of a copper material which contains: one or more types of additive elements selected from Ca, La, and Ce in a total of 3 ppm by mass to 400 ppm by mass; and a balance being Cu and inevitable impurities and in which a total concentration of the inevitable impurities excluding O, H, C, N, and S which are gas components is 5 ppm by mass to 100 ppm by mass.