The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Mar. 08, 2018
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Makoto Fujikawa, Nirasaki, JP;

Reiji Niino, Nirasaki, JP;

Hiroyuki Hashimoto, Nirasaki, JP;

Tatsuya Yamaguchi, Nirasaki, JP;

Syuji Nozawa, Nirasaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); B05D 1/00 (2006.01); H01L 21/02 (2006.01); C23C 16/44 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B05D 1/60 (2013.01); B05D 1/002 (2013.01); C23C 16/4411 (2013.01); C23C 16/45523 (2013.01); C23C 16/45574 (2013.01); C23C 16/45578 (2013.01); C23C 16/45591 (2013.01); C23C 16/45597 (2013.01); H01L 21/02118 (2013.01); H01L 21/02271 (2013.01); H01L 21/67017 (2013.01); H01L 21/67109 (2013.01);
Abstract

A film forming apparatus includes: a film forming gas discharge part; an exhaust port; a rotation mechanism; a heating part configured to heat the interior of a reaction container to a temperature lower than a temperature of a film forming gas discharged from the film forming gas discharge part; first gas discharge holes opened, in the film forming gas discharge part, toward a gas temperature reducing member so that the film forming gas is cooled by colliding with the gas temperature reducing member inside the reaction container before the film forming gas is supplied to substrates; and second gas discharge holes opened, in the film forming gas discharge part, in a direction differing from an opening direction of the first gas discharge holes so that the film forming gas does not collide with the gas temperature reducing member before the film forming gas is supplied to the substrates.


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