The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2021
Filed:
Oct. 01, 2016
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); B23K 35/24 (2006.01); C22C 13/00 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); B23K 35/0238 (2013.01); B23K 35/0244 (2013.01); B23K 35/24 (2013.01); B23K 35/262 (2013.01); C22C 13/00 (2013.01); H01L 23/00 (2013.01); H01L 23/49816 (2013.01); H01L 23/49866 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13247 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01);
Abstract
Embodiments are generally directed to indium solder metallurgy to control electro-migration. An embodiment of an electronic device includes a die; and a package substrate, wherein the die is bonded to the package substrate by an interconnection. The interconnection includes multiple interconnects, and wherein the interconnection includes a solder. The solder for the interconnection includes a combination of tin (Sn), copper (Cu), and indium (In).