The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

May. 04, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Roey Shaviv, Palo Alto, CA (US);

Xikun Wang, Sunnyvale, CA (US);

Ismail Emesh, Sunnyvale, CA (US);

Jianxin Lei, Fremont, CA (US);

Wenting Hou, Sunnyvale, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/67 (2006.01); H01L 21/285 (2006.01); H01L 21/3213 (2006.01); H01L 21/02 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76883 (2013.01); H01L 21/02068 (2013.01); H01L 21/28568 (2013.01); H01L 21/32135 (2013.01); H01L 21/67184 (2013.01); H01L 21/67207 (2013.01); H01L 21/76843 (2013.01); H01L 21/76877 (2013.01); H01L 21/76895 (2013.01); H01L 23/53209 (2013.01); H01L 21/2855 (2013.01); H01L 21/28556 (2013.01);
Abstract

Embodiments of methods and apparatus for filling a feature disposed in a substrate are disclosed herein. In some embodiments, a method for filling a feature disposed in a substrate includes (a) depositing a metal within the feature to a first predetermined thickness in a first process chamber; (b) depositing the metal within the feature to a second predetermined thickness in a second process chamber; (c) etching the metal deposited in (b) to remove an overhang of the metal at a top of the feature in a third process chamber different than the first and second process chambers; and (d) subsequent to (c), filling the feature with the metal in a fourth process chamber different than the first and third process chambers.


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