The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Jul. 27, 2016
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Assignee:
SHOWA DENKO MATERIALS CO., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/44 (2006.01); C08F 265/06 (2006.01); H01L 27/146 (2006.01); H01L 31/0203 (2014.01); C09J 133/00 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); G02B 3/00 (2006.01); G02B 13/00 (2006.01); C09J 151/00 (2006.01); G02B 7/02 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01);
U.S. Cl.
CPC ...
C08F 2/44 (2013.01); C08F 265/06 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 133/00 (2013.01); C09J 151/003 (2013.01); G02B 3/00 (2013.01); G02B 7/025 (2013.01); G02B 13/0085 (2013.01); H01L 23/29 (2013.01); H01L 23/31 (2013.01); H01L 27/14627 (2013.01); H01L 27/14685 (2013.01); H01L 31/0203 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/181 (2013.01);
Abstract
An adhesive composition comprising (a) a (meth)acrylic polymer, (b) a compound having at least two (meth)acryloyl groups, (c) a polymerization initiator and (d) a filler.