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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10943843 B1

PDFFull Text
Date of Patent:
Mar. 09, 2021

Filed:

Jan. 07, 2019

Semiconductor package structure

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Hsiu-Chi Liu, Kaohsiung, TW;

Hsu-Nan Fang, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Shouxiang Hu

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 21/76874 (2013.01); H01L 23/3107 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/3157 (2013.01); H01L 23/49833 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 24/96 (2013.01); H01L 25/0655 (2013.01); H01L 2224/02373 (2013.01);
Abstract

A semiconductor package structure includes a conductive trace layer, a semiconductor die over the conductive trace layer, a structure enhancement layer surrounding the semiconductor die, and an encapsulant covering the semiconductor die and the structure enhancement layer. The structure enhancement layer coincides with a mass center plane of the semiconductor package structure. The mass center plane is parallel to a top surface of the semiconductor die. A method for manufacturing the semiconductor package structure is also provided.

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Liu, Hsiu-Chi. (2021). Semiconductor package structure (U.S. Patent No. 10943843). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10943843

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