The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2021
Filed:
Oct. 20, 2017
Shanghai Micro Electronics Equipment (Group) Co., Ltd., Shanghai, CN;
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD., Shanghai, CN;
Abstract
An apparatus and method for die defect detection are disclosed. The apparatus includes: a light source unit () for emitting light of at least two wavelengths; a beam splitter () for receiving the light emitted by the light source unit () and splitting it into a first portion and a second portion, the first portion of the light reflected by a die () surface under inspection and thereby forming a detection beam; a reference unit () for receiving the second portion of the light and processing it into a reference beam; and a detection unit () for receiving the detection beam and the reference beam. The reference beam crosses the detection beam at an angle and thus produces interference fringes on a sensing surface of the detection unit (), based on which a defect parameter of the die () surface under inspection is determined. This apparatus is capable of measuring a die with improved accuracy and efficiency and is suitable for the measurement of large dies.