The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

Jul. 30, 2018
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Fu-Jier Fan, Hsinchu, TW;

Kong-Beng Thei, Hsin-Chu Country, TW;

Szu-Hsien Liu, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 21/285 (2006.01); H01L 21/311 (2006.01); H01L 21/8234 (2006.01); H01L 21/8238 (2006.01); H01L 29/78 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
H01L 29/6656 (2013.01); H01L 21/02271 (2013.01); H01L 21/28525 (2013.01); H01L 21/31111 (2013.01); H01L 21/31144 (2013.01); H01L 21/823437 (2013.01); H01L 21/823468 (2013.01); H01L 29/6653 (2013.01); H01L 21/823864 (2013.01); H01L 29/4916 (2013.01); H01L 29/78 (2013.01);
Abstract

A spacer structure and a fabrication method thereof are provided. First and second conductive structures are formed over a substrate. A first patterned dielectric layer is formed to cover the first conductive structure and exposing the second conductive structure. A second dielectric layer is formed to cover the first patterned dielectric layer and an upper surface and sidewalls of the second conductive structure. The second dielectric layer disposed over an upper surface of the first conductive structure and the upper surface of the second conductive structure is removed. The first patterned dielectric layer and the second dielectric layer disposed on sidewalls of the first conductive structure form a first spacer structure, and the second dielectric layer disposed on the sidewalls of the second conductive structure forms a second spacer structure. A width of the first spacer structure is larger than a width of the second spacer structure.


Find Patent Forward Citations

Loading…