The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

Sep. 25, 2018
Applicant:

Suss Microtec Lithography Gmbh, Garching bei Muenchen, DE;

Inventors:

Yasuaki Amano, Munich, DE;

Sven Hansen, Munich, DE;

Lennert Schwart, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); G03F 7/20 (2006.01); B25B 11/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); B25B 11/005 (2013.01); G03F 7/2014 (2013.01); G03F 7/707 (2013.01); G03F 7/7035 (2013.01); H01L 21/682 (2013.01); H01L 21/68728 (2013.01); H01L 21/68735 (2013.01); H01L 21/6836 (2013.01); H01L 2221/68327 (2013.01);
Abstract

A wafer support system has a wafer support device and a dicing frame, wherein the wafer support device has a bottom plate and a top plate. The top plate has a support surface for supporting the wafer, and the bottom plate has a maximum diameter being larger than the maximum diameter of the top plate so that the bottom plate forms a repository for the dicing frame. The dicing frame has a plate-like shape defining a center hole, wherein the minimum diameter of the center hole is larger than the maximum diameter of the top plate so that the dicing frame sinks below the upper surface of the wafer and/or the support surface. Further, a wafer support device, a wafer support system and a mask aligner are provided.


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