The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Dec. 28, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Jingjing Liu, Milpitas, CA (US);

Ludovic Godet, Sunnyvale, CA (US);

Srinivas D. Nemani, Sunnyvale, CA (US);

Yongmei Chen, San Jose, CA (US);

Anantha K. Subramani, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); H01L 21/265 (2006.01); H01J 37/34 (2006.01); C23C 14/50 (2006.01); C23C 14/35 (2006.01); C23C 14/48 (2006.01); H01J 37/32 (2006.01); H01L 21/223 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3485 (2013.01); C23C 14/35 (2013.01); C23C 14/48 (2013.01); C23C 14/50 (2013.01); H01J 37/32412 (2013.01); H01J 37/32706 (2013.01); H01J 37/32862 (2013.01); H01J 37/3405 (2013.01); H01J 37/3467 (2013.01); H01L 21/2236 (2013.01); H01L 21/26513 (2013.01); H01J 37/32834 (2013.01);
Abstract

Embodiments of the present disclosure provide a sputtering chamber with in-situ ion implantation capability. In one embodiment, the sputtering chamber comprises a target, an RF and a DC power supplies coupled to the target, a support body comprising a flat substrate receiving surface, a bias power source coupled to the support body, a pulse controller coupled to the bias power source, wherein the pulse controller applies a pulse control signal to the bias power source such that the bias power is delivered either in a regular pulsed mode having a pulse duration of about 100-200 microseconds and a pulse repetition frequency of about 1-200 Hz, or a high frequency pulsed mode having a pulse duration of about 100-300 microseconds and a pulse repetition frequency of about 200 Hz to about 20 KHz, and an exhaust assembly having a concentric pumping port formed through a bottom of the processing chamber.


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