The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2021
Filed:
Jun. 30, 2019
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Ati Technologies Ulc, Markham, CA;
Chun-Hung Lin, Hsinchu, TW;
Rahul Agarwal, Livermore, CA (US);
Milind Bhagavat, Los Altos, CA (US);
Fei Guo, Ottawa, CA;
ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US);
ATI TECHNOLOGIES ULC, Markham, CA;
Abstract
Various multi-die arrangements and methods of manufacturing the same are disclosed. In one aspect, a semiconductor chip device is provided that includes a first molding layer and an interconnect chip at least partially encased in the first molding layer. The interconnect chip has a first side and a second side opposite the first side and a polymer layer on the first side. The polymer layer includes plural conductor traces. A redistribution layer (RDL) structure is positioned on the first molding layer and has plural conductor structures electrically connected to the plural conductor traces. The plural conductor traces provide lateral routing.